SYSTEM DESIGN SPECIFICATION

Evidence Pack Architecture

DOCUMENT_ID SYS-EPK-SPEC-04A
VERSION 2026.06.13
CLASSIFICATION TECHNICAL / PUBLIC METHODOLOGY
STATUS APPROVED FOR SYSTEM REVIEW
02 / CORE PHILOSOPHY

Why Evidence Exists

What is this Evidence Pack?

This Evidence Pack links project requirements, compiler checks, generated artifacts, and release metadata into a static audit trail.

What was verified?

The pack verifies that selected electrical, footprint, routing, and release checks were executed during the build.

How is tampering detected?

SHA-256 cryptographic hashes / checksums are used to detect unexpected changes in compiled templates and evidence metadata. If a signing key is added later, the pack can be extended with digital signatures.

Redacted Evaluation Sample

Download a mock redacted Evidence Pack JSON for B2B evaluation purposes.

Download sample Evidence Pack

Statistical AI models are optimized to predict plausible sequences of text, not the strict requirements of physical hardware. In power electronics or high-density routing, a design proposal that is 98% correct carries a 100% chance of layout failure, overheating, or circuit destruction in the laboratory.

OmeraCode replaces probability with proof. Correctness is never assumed; it is strictly audited, calculated via isolated mathematical solvers, and logged as verifiable proof. The resulting Evidence Pack is an immutable trail of verification that accompanies the manufacturing package.

03 / TRACEABILITY VERIFICATION

Requirement Trace Matrix (RTM)

The RTM is the core validation bridge in OmeraCode. It connects high-level requirements directly to physical board constraints, mathematical calculations, and passing test statuses.

01 / REQUIREMENT
REQ-089 // CURRENT_LOAD

Must handle 10A continuous current

Source: SPECS-POWER-BOARD-V2.pdf

↓ Mapped to Constraint Parameters
02 / DERIVED CONSTRAINTS
PARAM_01 // COPPER_WIDTH
Trace Width ≥ 4.25 mm IPC-2152 Internal
PARAM_02 // COPPER_THICKNESS
Copper Thickness ≥ 35 μm (1 oz) Layer Stackup
PARAM_03 // TEMP_RISE
Max Temp Rise ≤ 20°C Thermal Boundary
PARAM_04 // SAFETY_MARGIN
Safety Spacing ≥ 0.50 mm IPC-2221 Spacing
↓ Calculated & Checked
03 / VERIFICATION RESULTS
SOLVER-2152-RUN

IPC-2152 Thermal Equation Solver

PASS

Calculated temperature rise: 14.8°C at 10A current on 4.50 mm trace. Spacing audited at 0.65 mm clearance.

↓ Locked & Fingerprinted
04 / COMPILATION STATE
EPK_EXPORT_TARGET // LOCKED

Packaged into Evidence Pack: D:\omeracode_web\exports\EP-2026-0613.epk

REFERENCE IMPLEMENTATION

3-Phase Motor Controller Case Study

Review an end-to-end trace of design constraints, calculations, and active review logs for a production-grade 30A brushless motor controller.

04 / ENGINEERING ARTIFACTS

Verification Artifacts

Authentic engineering output requires systematic progression. The OmeraCode pipeline structures verification data in a strict logical order:

01 / CONSTRAINTS

Constraint Rules Definition

Parameters extracted from manufacturer datasheets and mechanical specifications are compiled into rules. For example, voltage boundaries dictate spacing clearance rules based on IPC-2221 Table 6.1 (e.g., 0.50 mm clearance for 12V inputs).

02 / CALCULATIONS

Deterministic Math Solvers

Trace width calculations use the IPC-2152 current vs. temperature rise standards. Impedance math applies microstrip differential equations. Thermal dissipation is solved via 2D Fourier grid conduction heat models. Calculations are mathematically closed and contain zero predictive estimation.

03 / DRC REPORTS

Design Rule Checks

Physical layouts are checked against electrical constraints. Checks verify annular ring sizes, track clearances, trace aspect ratios, and loop areas. Warnings are compiled for any structural deviations.

04 / REVIEW NOTES

Design Review Record

Every exception or layout override is logged as a persistent engineering review item. These items track the reviewer, the severity, the engineering action, and the resolution state.

DESIGN REVIEW RECORD // ID-774 RESOLVED (ACCEPTED)
REVIEWER: Senior Hardware Engineer
FINDING: Thermal margin insufficient on VCC_SYS
SEVERITY: HIGH
ACTION: Increase copper width
RESOLUTION: Copper width increased from 0.75 mm to 1.20 mm
05 / FAILURE MODES

When Verification Fails

A robust co-design system must enforce strict discipline. When OmeraCode detects a constraint drift, calculation mismatch, or unresolved review note, it does not bypass the error to produce a schematic. Instead, the build process halts immediately.

VERIFICATION FAILURE // PIPELINE BLOCK BLOCKED
NET_NAME: VCC_5V
FINDING: Calculated temperature rise (26.3°C) exceeds net budget limits (20.0°C)
CONSTRAINT: RULE_SYS_TEMP_RISE
RESULT: Release package generation blocked. Requires copper thickness stackup adjustment or net trace expansion.

Halting on failure ensures that layout proposals cannot bypass physical logic. Release state packages are restricted from packaging until all warnings are mathematically resolved or explicitly signed off by a human authority.

06 / AUDIT CHECKLIST

Release Readiness

A design's readiness is earned through cumulative check validations. The OmeraCode compiler enforces a final checklist validation before cryptographic packaging:

RELEASE GATE CRITERIA
  • [✓] Requirements traced
  • [✓] Calculations verified
  • [✓] DRC clean
  • [✓] Review findings resolved
  • [✓] Manufacturing package generated
  • [✓] Package signed
07 / COMPONENT STRUCTURE

Evidence Package Structure

When release gates pass, the compiler packages all generated artifacts into an Evidence Pack (.epk directory), structured as follows:

EP-2026-0613.epk/
├── metadata.json           # Cryptographic manifest and metadata
├── requirements/
│   ├── specs.json          # Mapped requirement parameters
│   └── trace_matrix.json   # Requirement-to-layout trace references
├── verification/
│   ├── solvers/            # Mathematical calculation sheets
│   ├── drc/                # DRC clearance audit reports
│   └── reviews.json        # Design review logs & sign-offs
├── release/
│   ├── gerber/             # Manufacturing drill and layout files
│   ├── schematic.pdf       # Electrical design schematics
│   └── bom.csv             # Procurement part checklist
└── signatures/
    └── system_keys.sig     # Cryptographic signature payload
08 / CRYPTOGRAPHIC INTEGRITY

Integrity Layer

The integrity layer acts as the safety latch of the system. We do not use hashing to build complex blockchain architectures, but rather to guarantee data cohesion.

Every release package is fingerprinted. Any modification invalidates the package signature and requires re-verification.

This simple checksum mechanism ensures that electrical schematics, physical layouts, calculations, and reviewer sign-offs cannot drift out of alignment after the package is finalized.

09 / DOCUMENT EXPLORATION

Interactive EPK Document Browser

Review a simulated, redacted OmeraCode Evidence Pack structure using the engineering document browser below. Select tabs to switch between specification items, mathematical solvers, layout rule checks, and signature logs.

EVIDENCE PACK SYSTEM VIEW: EP-2026-0613.epkSECURE AUDIT STATE: LOCKED
PARAMETER IDTARGET VALUESOURCE DOCUMENTVALIDATION STATUS
VDD_IN_MAX12.0 V ± 2%Datasheet-TPS563200RESOLVED_MATCH
IMAX_SOLENOID2.2 A peakSpecs-Robotic-Arm-V3RESOLVED_MATCH
DRC_TRACE_MIN0.20 mmIPC-2221B Class 2POLICY_ENFORCED
TEMP_OPER_MAX85 °C ambientThermal-Spec-V1CALCULATOR_BOUND
Input parameters parsed from specification files: TPS563200_DS.pdf, SPEC_ARM_V3.docx.
Assumptions checksum: sha256-3c22f019b88e5d0a920f